Our SMD machinery is updated constantly. Besides reflow-process, we have both RohS- and conventional wave soldering. The conventional process is only for products, which have exception in RoHS directive. In SMD-production we can use components from 01005 to 50 x 150 mm. BGA:s can be handled at least down to 0,3 mm. X-ray inspection can be included to bumped components.

A modified, heavy 16 zone convection oven is used for standard SMD soldering. Profiling is done with multi-channel profiler equipped with the latest programs. Lead-free wave soldering requires effective preheating with IR and convection.

Up-to-date machinery, good process control and motivated staff together are our key to success.